◆ High-throughput surface grinding

Equipped with a high-efficiency ion gun with a section grinding capacity of 500 µm/h*2 or more. Therefore, even with hard materials, cross-sectional samples can be prepared efficiently.

*2 The ultra-large depth when Si is protruded 100 µm from the edge of the shielding plate and processed for 1 hour at an acceleration voltage of 6 kV

◆ Section grinding

image.png Even composite materials composed of components with different hardness and grinding speed can produce smooth cross-section samples

image.png Optimize processing conditions and reduce damage

image.png Can load oversized samples of 20 mm(W) × 12 mm(D) × 7 mm(H)

The main purpose of section grinding

image.png Preparation of cross-sections of various samples such as metals, composite materials, and polymer materials

image.png Preparation of cross-sections for analysis of defects such as cracks and voids

image.png Preparation of the interface of the deposited layer and the cross section of the crystalline state for evaluation, observation and analysis

              断面研磨加工原理图

◆ Flat Milling®

image.png Evenly processed into a range of about 5mm in diameter

image.png can be used in a wide range of fields that meet its purpose

image.pngCan load samples with a diameter of 50 mm × a thickness of 25 mm

image.png Two processing methods can be selected: rotation and swing (±60°～±90° flip)

The main application of Flat Milling®

image.pngRemoves small scratches and deformations that are difficult to eliminate in mechanical grinding

image.pngRemove the surface layer of the sample

image.pngEliminate the damage of FIB processing

     Flat Milling&reg processing principle diagram

◆ Combine with Hitachi SEM samples

image.pngThe sample can be observed directly on the SEM without removing it from the sample stage.

image.pngOn the draw-out Hitachi SEM, the cross-section and flat grinding rods can be set according to different samples. Therefore, after observation on the SEM, it can be reprocessed as needed.

*1 The maximum depth of Si protruding 100 µm from the edge of the shielding plate and processing for 1 hour

*2 The amount of movement of the shielding plate when the micrometer rotates one revolution. Section grinding gripper ratio is 1/5

◆ Atmospheric isolation sample holder

The atmosphere isolates the sample rod, allowing the sample to be ground without contact with air.

The sealed cover seals the sample. After entering the evacuated sample chamber, open the sealed cover. In this way, the sample processed by ion milling can be directly set on the SEM*1, FIB*1, and AFM*2 without contacting air.

*1 Only Hitachi FE-SEM and FIB with atmospheric isolation sample exchange chamber are supported.

*2 Only vacuum type Hitachi AFM is supported.

Lithium-ion battery negative electrode (after charging)

                Atmospheric exposure                                             Atmospheric isolation                               

◆ Stereo microscope for observation during processing

IM4000 and IM4000PLUS can observe the sample in the grinding process through the stereo microscope set above the sample chamber.

If it is a trinocular type, it can be monitored and observed through a CCD camera *3.

*3The CCD camera and monitor are prepared by the customer.

◆ Cooling temperature adjustment function*1

                                                                                                    IM4000PLUS with cooling temperature adjustment function

This function can effectively prevent the dissolution and deformation of the sample due to the temperature rise of the sample caused by the ion beam irradiation during the processing. For samples that will crack after excessive cooling, the cooling temperature adjustment function can prevent them from cracking due to excessive cooling.

*1 This adjustment function is not a standard feature of IM4000PLUS, but an IM4000PLUS function equipped with a cooling temperature adjustment function.

Sample: lead solder

               Grinding at room temperature                                      Cooling and grinding                                                   

◆ Section grinding

If it is an angular ceramic capacitor of about 500 µm, a smooth cross-section can be produced in 3 hours.

Sample: ceramic capacitor

                   Low magnification image                                         Zoom in image                                 

Even with multi-layer structural materials with different hardness and composition, cross-sections can be prepared.

Sample: bumper coating film

            Low magnification image                                                 Zoom in image                       

This is an application example where a smooth cross-section is obtained by grinding the cross-section of the positive electrode material of a lithium battery.

From the SSRM (Scanning Spread Resistance Microscopy) image, the part with special contrast observed on the SEM is considered to be the part with low resistance.

Sample: Lithium-ion battery cathode material Sample preparation method: Section grinding

                 Lithium-ion battery cathode material: secondary electron image/SSRM image       

◆ Flat Milling

It can remove grinding damage and sag caused by mechanical grinding, and can observe the Ag distribution of metal layer, alloy layer and lead-free solder.

Sample: Lead-free solder

               After mechanical grinding                                           After surface grinding                                 

Observation and analysis surfaces that have become dirty due to aging can also be polished to obtain clear channel contrast images and EBSD modes.

Sample: Copper gasket