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FIB-SEM three beam system NX2000

FIB-SEM three beam system NX2000

  • Classification:Focused ion beam system
  • Number of Views:second
  • Date of issue:2021-11-18 10:53:40
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In the field of evaluation and analysis of cutting-edge equipment and high-performance nanomaterials, FIB-SEM has become an indispensable tool. Recently, the target observation object has become more refined; the preparation requirements for thinner, lower-damage samples have become more prominent.
  • characteristic
  • Specifications
  • option
  • function
  • Observation example

◆ Using high contrast, real-time SEM observation and processing endpoint detection functions, ultra-thin samples with a thickness of less than 20 nm can be prepared

Real-time SEM observation during FIB processing *2 cases


Sample: NAND flash memory


Accelerating voltage: 1 kV


FOV: 0.6 µm


◆ The processing direction control technology (Micro-sampling®*3 system (optional) + high-precision/high-speed sample stage*) has high hopes for suppressing the curtain effect and making film samples with uniform thickness.

     

  Processing direction control                 During normal processing                  


◆ Triple Beam®*1 (optional) can improve processing efficiency, and can automatically eliminate FIB damage

EB: Electron Beam


FIB: Focused Ion Beam (focused ion beam)


Ar: Ar ion beam


Options:

Ar/Xe ion beam system


Micro-sampling®*3 system


Defect detection equipment combined software


CAD combined navigation software


EDS (Energy Spectrometer)


TEM sample finishing wizard


TEM sample thickness management software


Continuous A-TEM


Real-time image quality optimization system


Swing processing function (for Triple Beam®*1)


Plasma cleaning machine


Vacuum transfer mechanism


Cold table



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