◆ Large probe current 90nA, realizing rapid processing and large area processing

Cross-section processing of welding wire

(Processing size 　Width: 95µm　Depth: 55µm, Processing time 　20min)

◆ By improving the processing of extremely low acceleration voltage (0.5kV～) and the resolution of low acceleration voltage secondary electron image, the preparation of TEM samples with lower damage rate is realized

*1kV or less is optional

◆ Observe high-resolution SIM imaging (secondary electron imaging resolution up to 4nm@30kV)

    Normal part            Bending part

Cross-section SIM image of aluminum can

◆ Adopt high-precision 5-axis electromechanical optimal center motor platform

When the sample stage is moving (including tilting), it can automatically perform a variety of processing on multiple parts.

◆ Superior operating performance and a variety of processing modes

image.pngSection preparation program processing

image.pngTEM/STEM sample program processing

image.png automatic continuous processing

image.pngTEM sample automatic continuous finishing software

image.png bitmap processing

image.pngVector Scan processing

image.pngPreparation of nano-precision three-dimensional structure samples Other

Fabrication of suspended nanowires

Sample source: Mr. Shinji Matsui, Hyogo Prefectural University

◆ SIM image 3D reconstruction analysis

Cross-section processing and cross-section observation at equal intervals are reciprocated, and multiple continuous SIM images of cross-sections can be taken, and 3D reconstruction can be carried out. From this, the three-dimensional distribution of particles and holes in the sample can be judged.

                                                                    Example of analysis of filler distribution in semiconductor packaging materials

◆ Use multi-channel gas system (MGS-II) to repair the circuit

The system can be used for various purposes such as protective film materials, wiring materials, insulating films, and accelerated etching, and can be irradiated with a variety of gases.

image.png Tungsten deposition gas

image.png Platinum deposition gas

image.png Deposition gas for insulating film preparation

image.png Xenon fluoride etching gas

image.png Organic etching gas

image.png Carbon deposition gas

Machining of large depth-to-diameter ratio holes using XeF2 gas

And the use of tungsten deposited leads

◆ Rich and diverse coordinate link function

Hitachi High-Tech's original coordinate link function is rich and diverse, which can determine the correct processing position and greatly shorten the time.

image.png Link between light mirror image and SIM image

image.png Dual cursor function

image.png Japanese Patent No. 4634134 US Patent No. 7595488

image.png Establish a coordinate link with defect detection equipment

image.png The truncated wafer or chip can also establish a coordinate link with the defect detection equipment.

image.png CAD combined navigation software

image.png 4-channel gas supply system

image.png Automatic continuous processing software

image.png TEM sample automatic processing software

image.png Controller microscope other

Various options of other MI series can be selected.